According to a report by PR Newswire on July 15th, SKkeyfoundry, a South Korean 8-inch pure wafer foundry, announced that it has successfully developed the key packaging technology DirectRDL (rewiring Layer) based on 8-inch wafers in collaboration with LBSemicon and completed reliability tests.

According to a report by PR Newswire on July 15th, SK keyfoundry, a South Korean 8-inch pure wafer foundry, announced that it has successfully jointly developed the key packaging technology Direct RDL (rewiring Layer) based on 8-inch wafers with LB Semicon and completed reliability tests.

Public information shows that SK keyfoundry, headquartered in South Korea, is an 8-inch pure wafer foundry specializing in analog and mixed-signal fields, providing professional services to semiconductor companies in multiple fields such as consumer electronics, communications, computing, automotive, and industrial.

LB Semicon is also a South Korean enterprise, but its business focuses on the field of semiconductor packaging and testing. As the largest DDI packaging market player in South Korea, it has numerous Fabless customers such as Samsung Electronics, LX Semicon, and Novatech.

It is understood that the Direct RDL technology jointly developed by both sides this time supports power semiconductors with high current capacity and its performance surpasses similar technologies. This process can achieve a metal wiring thickness of up to 15 microns and a wiring density covering 70% of the chip area. It is not only applicable to the mobile and industrial fields but also meets the requirements of automotive applications. Moreover, this technology meets the Auto Grade 1 requirements of the international automotive semiconductor quality standard AEC-Q100, ensuring the stable operation of the chip in the harsh environment ranging from -40 ℃ to +125℃. It is currently one of the few solutions that are fully applicable to automotive products.

RDL refers to the metal wiring and insulation layer built on the surface of semiconductor chips, which is used to achieve electrical connection between the chip and the substrate. This technology is mainly applied in WLP (Wafer-level Packaging) and FOWLP (fan-out wafer-level Packaging) processes, which helps enhance the interconnectivity between chips and substrates and reduce signal interference. As a core component of advanced packaging such as WLP/FOWLP, RDL technology directly affects the miniaturization, high density and reliability of packaging.

LB Semicon has been actively expanding its business layout in recent years. The company initially started with the Gold Bumping business of display driver chips (DDI), and now has expanded its business to fields such as communication semiconductors and power management semiconductors. In 2022, it was reported that the company planned to develop a new generation of semiconductor packaging technology "FOWLP" that year. The company intends to use FOWLP technology to balance the development of its business structure, which is more focused on display driver chips (DDI), and achieve diversification of its business structure.

The joint development of the Direct RDL key packaging technology with SK keyfoundry this time is also one of its measures to enhance the competitiveness of the enterprise. As Namseog Kim, the CEO of LB Semicon, said: "This joint development is an important milestone in strengthening the technological competitiveness of both sides." In the future, we will continue to deepen our cooperation and jointly take root in the next-generation semiconductor packaging market on the basis of high reliability.

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