On July 17th, China Microelectronics Corporation released its semi-annual performance forecast for 2025, expecting to achieve operating revenue of approximately 4.961 billion yuan, representing a year-on-year growth of about 43.88%.

On July 17th, China Microelectronics Corporation released its semi-annual performance forecast for 2025, expecting to achieve operating revenue of approximately 4.961 billion yuan, representing a year-on-year growth of about 43.88%. The net profit attributable to shareholders of the parent company was between 680 million yuan and 730 million yuan, representing a year-on-year increase of 31.61% to 41.28%.

The company's main products include high-end semiconductor and general semiconductor equipment such as plasma etching equipment, thin film equipment, and MOCVD equipment. In the first half of 2025, the revenue from etching equipment reached 3.781 billion yuan, representing a year-on-year growth of approximately 40.12%. Revenue from LPCVD thin-film equipment reached 199 million yuan, increasing by approximately 608.19% year-on-year.

During the reporting period, the company's high-end etching products achieved large-scale mass production in key process links of advanced logic and memory device manufacturing, and the new shipment volume increased significantly.

In addition, on March 12th, China Microelectronics Corporation announced that the global cumulative shipment of its plasma etching equipment has exceeded 5,000 units, covering four configurations: CCP high-energy plasma etching machines, ICP low-energy plasma etching machines, single reaction tables, and double reaction table reactors.

In terms of research and development, the company's R&D investment in the first half of the year was approximately 1.492 billion yuan, an increase of about 53.70% year-on-year, accounting for 30.07% of its operating income. The current research projects cover six major categories of equipment and over twenty new products. The speed of product research and development has significantly accelerated, reducing from the previous 3 to 5 years to 2 years or even shorter. Competitive new products have been launched to the market at an accelerated pace, and the company is expected to launch a large number of new products in the coming years.

In terms of project construction, on March 26th, the company won a plot of industrial land in the core area of Zengcheng Economic and Technological Development Zone. It plans to invest 3 billion yuan in the long term to build the South China headquarters and product research and development production base, focusing on large flat panel display equipment and expanding into emerging micro-processing fields such as smart glass and plate-level packaging.

On April 7th, the company held a signing ceremony for the micro-processing equipment R&D center in Nanchang, planning to increase its R&D investment in the Nanchang High-tech Zone. Promote the development of advanced semiconductor manufacturing equipment and processes for packaging, related equipment for third-generation semiconductor power devices, the application and promotion of MOCVD equipment for Micro leds, and the performance optimization of MOCVD equipment for Mini leds.

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